Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique

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Periodical:

Key Engineering Materials (Volumes 270-273)

Edited by:

Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee

Pages:

1833-1838

DOI:

10.4028/www.scientific.net/KEM.270-273.1833

Citation:

W. Yi et al., "Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique", Key Engineering Materials, Vols. 270-273, pp. 1833-1838, 2004

Online since:

August 2004

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$35.00

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