Reflow Characteristics of Copper in an Oxygen Ambient

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Periodical:

Key Engineering Materials (Volumes 270-273)

Edited by:

Seung-Seok Lee, Dong-Jin Yoon, Joon-Hyun Lee and Sekyung Lee

Pages:

820-825

Citation:

S. H. Kim and D. W. Kim, "Reflow Characteristics of Copper in an Oxygen Ambient", Key Engineering Materials, Vols. 270-273, pp. 820-825, 2004

Online since:

August 2004

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$38.00

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[3] K. K. Choi, S. W. Rhee : Thin Solid Films, Vol. 397 (2001), p.70.

[4] S. K. Rha, W. J. Lee, S. Y. Lee, D. W. Kim and C. O. Park : J. of Materials Science: Materials in Electronics, Vol. 8 (1997), p.217.

[5] S.Y. Lee, D. W. Kim, S. K. Rha, J. W. Park and H. H. Park : J. Vac. Sci. Technol. B Vol. 16 (1998), p.2902.

[6] K. K. Choi, J. H. Yun, S. W. Rhee : Thin Solid Films, Vol. 429 (2003), p.255.

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