Effect of Lead Excess on the Formation and Dielectric Properties of Silver Dispersed Lead Titanate Film
Silver dispersed lead titanate films were prepared with different Pb/Ti ratio precursors. The influence of lead excess in precursor on the formation and dielectric properties of silver-dispersed lead titanate film was investigated. Firstly, Pb excess in precursor will eliminate the formation of pyrochlore PbTi3O7 and increase c/a ratio of perovskite PbTiO3. Secondly, excessive Pb will react with silver, and they can produce volatile product, which evaporate during heat treatment process. The volatility of the reaction product varies with the increase in lead excess. When lead excess is low (Pb/Ti=1.1), volatility of reaction product is high. At this time, only small amount of silver remain in the film. The remanent silver aggregate to form small silver particles. When lead excess is high (Pb/Ti=1.2 and Pb/Ti=1.3), volatility of reaction product gradually becomes poor. At this time, the content of remanent silver in the film increase with the increase in lead excess. Compared with the film prepared with low Pb/Ti ratio, the dispersive degree of silver in film prepared with high Pb/Ti ratio is higher. Due to the decrease of remanent silver content in the film, dielectric constant and dissipation factor both decrease when Pb/Ti initially increase from 1 to 1.1. And after that, dielectric constant and dissipation factor both increase with the addition of excessive Pb in precursor, due to the increase in the content and dispersion degree of silver, and increase in c/a ratio of PbTiO3 lattice with the addition of excess Pb. The film prepared with appropriate excessive lead (Pb/Ti=1.3) precursor expresses higher dielectric constant and lower dissipation factor than the film prepared with stoichiometric Pb/Ti ratio.
Wei Pan, Jianghong Gong, Chang-Chun Ge and Jing-Feng Li
L.W. Tang et al., "Effect of Lead Excess on the Formation and Dielectric Properties of Silver Dispersed Lead Titanate Film", Key Engineering Materials, Vols. 280-283, pp. 107-110, 2005