Wettability of ceramics by liquid metals is of importance for joining of ceramics to metals and manufacturing of cermets. Wettability of reaction bonded SiC /Ag plus Ti system was studied. The contact angle was determined by high temperature photography. The microstructure and composition of the interfacial region were analyzed. For SiC/pure Ag system, the contact angle at 998°C in vacuum is 128.4º. The wettability of the system is remarkably improved by adding Ti into the metallic filler. Also, the contact angle of the system is strongly affected by the wetting temperature and the dwelling time. The results indicate that interfacial reactions take place during the test, and the reactions facilitate the wetting. Microstructural study reveals that inter-diffusion takes place and a reaction layer forms at the interface.