Image Distortion Compensation by Using a Polynomial Model in an X-Ray Digital Tomosynthesis System


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X-ray technology has been widely used in a number of industrial applications for monitoring and inspecting inner defects which can hardly be found by normal vision systems as a ball grid array (BGA) or a flip chip array (FCA). Digital tomosynthesis (DT) is one of the most useful X-ray cross-sectional imaging methods for PCB inspection, and it usually uses an X-ray image intensifier. However, the image intensifier distorts X-ray images severely both of shape and intensity. This distortion breaks the correspondences between those images and prevents us from acquiring accurate cross-section images. Therefore, image distortion compensation is one of the most important issues in realizing a DT system. In this paper, an image distortion compensation method for an X-ray DT system is presented. It is to use a general distortion polynomial model on two dimensional plane that can cope with arbitrary, complex and various forms of distortion. Experimental results show a great improvement in compensation speed and accuracy.



Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim




J.Y. Kim and J.S. Yoon, "Image Distortion Compensation by Using a Polynomial Model in an X-Ray Digital Tomosynthesis System ", Key Engineering Materials, Vols. 297-300, pp. 2034-2039, 2005

Online since:

November 2005





[1] J. Adams: X-ray laminography analysis of ultra fine pitch solder connections on ultra-thin boards, SPIE Integrated Circuit Metrology, Inspection and Process Control V, Vol. 1464 (1991), pp.484-497.


[2] R.H. Bossi and G.E. Georgeson: Casting development savings with X-ray computed tomography, Casting (1993), pp.181-188.

[3] E.M. Bocage: French Patent 536464 (1922).

[4] M. Rooks and T. Sack: X-ray inspection of flip chip attach using digital tomosynthesis, Surface Mount international conference, San Jose (1994), pp.51-55.


[5] D. L. Black and K. Nilson: An animated interface for X-ray laminographic inspection of fine- pitch interconnect, IEMT Symposium (1991), pp.207-211.


[6] H. Doi, Y. Suzuki and Y. Hara: Real-time X-ray inspection of 3-D defects in circuit board patterns, 5th International Conference on Computer Vision (1995), pp.575-582.

[7] Y.J. Roh, K.W. Ko, H.S. Cho and H.N. Joo: Inspection of ball grid array (BGA) solder joint using X-ray cross-sectional images, SPIE Intelligent Systems and Advanced Manufacturing VIII, Vol. 3836 (1999), pp.168-178.


[8] H.S. Cho and Y.J. Roh: Development of an PCB solder joints inspection system using X-ray, Research Report for Samsung Electronics, Korea Advanced Institute of Science and Technology (1997).

[9] Y.J. Roh, K.W. Ko, H.S. Cho, J.Y. Kim and J.E. Byun: The calibration of X-ray digital tomosynthesis system including the compensation of the image distortion, SPIE Symposium on Intelligent Systems and Advanced Manufacturing VII, Vol. 3528 (1998).

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