XRD Tensile Test Technique to Measure Mechanical Properties of Micron-Thick Si and TiN Films

Abstract:

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This paper focuses on investigating mechanical properties of micron-thick polycrystalline titanium nitride (TiN) films. We propose a new technique that can directly measure lateral strain of microscale crystalline specimen by X-ray diffraction (XRD) during tensile test. The XRD tensile test can provide not only Young’s modulus but also Poisson’s ratio of TiN films. Micron-thick TiN films were deposited onto both surfaces of single crystal silicon (Si) specimen by r.f. reactive magnetron sputtering. Young’s modulus and Poisson’s ratio of Si specimen obtained by XRD tensile tests were in good agreement with analytical values. TiN films deposited at Ar partial pressure of 0.7Pa had the average values of 290GPa and 0.36 for Young’s modulus and Poisson’s ratio. The elastic mechanical properties of TiN films gradually decreased down to 220GPa and 0.29 with increasing Ar partial pressure up to 1.0Pa, regardless of film thickness. The change in the film properties with Ar partial pressure would be attributed to the change in the film density.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

574-580

DOI:

10.4028/www.scientific.net/KEM.297-300.574

Citation:

T. Namazu et al., "XRD Tensile Test Technique to Measure Mechanical Properties of Micron-Thick Si and TiN Films ", Key Engineering Materials, Vols. 297-300, pp. 574-580, 2005

Online since:

November 2005

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$35.00

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