Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows

Abstract:

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The mechanical and electrical properties of the Sn-3.5Ag solder/Cu BGA packages were investigated as a function of number of reflows. A continuous scallop-shaped Cu6Sn5 intermetallic compound (IMC) layer was formed at the solder/Cu interface upon 1 reflow process. After 3 reflows, very thin layer of Cu3Sn IMC was observed at the Cu6Sn5/Cu interface. As the number of reflows increased, the thickness of these IMCs increased with a cube root of reflow time. Shear force slightly increased up to 4 reflows and then gradually decreased with increasing the number of reflows. The maximum shear force was 11.7N when the thickness of the IMC layers was 3.7㎛. The fracture surfaces of all the specimens showed ductile failure characteristics up to 4 reflows, and then the fraction of the brittle IMC fracture increased with the number of reflows. The electrical resistance of the BGA packages increased with the number of reflows.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

801-806

DOI:

10.4028/www.scientific.net/KEM.297-300.801

Citation:

J. M. Koo et al., "Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows", Key Engineering Materials, Vols. 297-300, pp. 801-806, 2005

Online since:

November 2005

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Price:

$35.00

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