Fabrication of Nanoabrasive Grinding Wheels and Their Application to Grinding Silicon Wafers
In the surface machining of brittle materials, there exists a transition from brittle to ductile modes when the depth of cut is reduced below a critical size using ultrafine abrasive grains. Vitrified grinding wheels containing ultrafine abrasives in the sub-micrometer to nanometer range were fabricated by mechanochemically milling nanoabrasive particles and subsequent viscous sintering of abrasive-binder composites. The grinding characteristics of the nanoabrasive grinding wheels were evaluated for the fine grinding of silicon wafers in terms of a variety of variables. Preliminary wafer grinding results are presented on material removal rate and surface quality of silicon wafers.
T. Ohji, T. Sekino and K. Niihara
T.W. Kim, S. H. Hyun, J. S. Kim, J. H. Lee, H. W. Lee, "Fabrication of Nanoabrasive Grinding Wheels and Their Application to Grinding Silicon Wafers", Key Engineering Materials, Vols. 317-318, pp. 373-376, 2006