Fabrication of Nanoabrasive Grinding Wheels and Their Application to Grinding Silicon Wafers

Abstract:

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In the surface machining of brittle materials, there exists a transition from brittle to ductile modes when the depth of cut is reduced below a critical size using ultrafine abrasive grains. Vitrified grinding wheels containing ultrafine abrasives in the sub-micrometer to nanometer range were fabricated by mechanochemically milling nanoabrasive particles and subsequent viscous sintering of abrasive-binder composites. The grinding characteristics of the nanoabrasive grinding wheels were evaluated for the fine grinding of silicon wafers in terms of a variety of variables. Preliminary wafer grinding results are presented on material removal rate and surface quality of silicon wafers.

Info:

Periodical:

Key Engineering Materials (Volumes 317-318)

Edited by:

T. Ohji, T. Sekino and K. Niihara

Pages:

373-376

DOI:

10.4028/www.scientific.net/KEM.317-318.373

Citation:

T.W. Kim, S. H. Hyun, J. S. Kim, J. H. Lee, H. W. Lee, "Fabrication of Nanoabrasive Grinding Wheels and Their Application to Grinding Silicon Wafers", Key Engineering Materials, Vols. 317-318, pp. 373-376, 2006

Online since:

August 2006

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Price:

$35.00

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