Out-of-Plane Micro-ESPI System for Measurement of Mechanical Properties of Film Materials


Article Preview

To measure the micro-mechanical properties for micro/nano materials, out-of-plane ESPI system and micro-strip bend testing system were developed. For the bending system, PZT actuator was controlled with the stroke resolution of 0.6 nm and out-of-plane ESPI system was developed in compact and portable type. To quantitatively analyze the out-of-plane ESPI fringe patterns, 4-bucket technique was used and unwrapped phase map was obtained. Electrolytic copper foil with the thickness of 18 μm was used for preparation of the strip bend specimen with length of 8 mm and three different widths of 2, 3 and 5 mm. The strip bending tests showed that the out-of-plane deflection in the bend specimen was measured with a maximum of 8 % in error. Furthermore, from the experiment, the variation of the deflection along the supporting span could be determined and significant region was linear.



Key Engineering Materials (Volumes 321-323)

Edited by:

Seung-Seok Lee, Joon Hyun Lee, Ik Keun Park, Sung-Jin Song, Man Yong Choi




D. I. Kim et al., "Out-of-Plane Micro-ESPI System for Measurement of Mechanical Properties of Film Materials", Key Engineering Materials, Vols. 321-323, pp. 116-120, 2006

Online since:

October 2006




[1] Mohamed Gad-el-Hak: The MEMS Handbook (CRC Press, 2002).

[2] W.N., Sharper, Jr., B. Yuan, and R.L., Edwards: J. microelectromechnical systems, Vol. 6 No. 3 (1997) p.193.

[3] M.A. Sutton, W.J. Wolters, W.H. Peters, and S.R. W.F.: Image Vision Computing, Vol. 1 (1983) p.133.

[4] D.T., Read: Mesaurement Science and Technology, Vol. 9 (1998), p.676.

[5] H.D. Espinosa, and B.C. Prorok, M. Fisher: Proc. of the SEM Annual Conf. (2001) p.446.

[6] Y. -H. Huh, D.I. Kim, D.J. Kim, P. Park, C.D. Kee, and J.H. Park : Key Eng. Materials, Vol. 270 (2004), p.744.

[7] D. W. Robinson, G. T. Reid: Interferogram Analysis: Digital fringe pattern measurement techniques (IOP publishing Ltd, 1993).