Reliability of Flip Chip Package with Underfills under Thermal Shock

Abstract:

Article Preview

The thermal fatigue properties of the solder joints with various underfills were evaluated by thermal shock test. Flip chip package with electroless nickel-immersion gold plated on Cu pad of FR-4 substrate and the Sn-37Pb solder ball was used. The thermal fatigue crack initiated at the edges of interface between solder and silicon die. The fatigue property of package with underfill, which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) value was better than that of package with underfill having a lower Tg and higher CTE.

Info:

Periodical:

Key Engineering Materials (Volumes 321-323)

Edited by:

Seung-Seok Lee, Joon Hyun Lee, Ik Keun Park, Sung-Jin Song, Man Yong Choi

Pages:

1719-1722

DOI:

10.4028/www.scientific.net/KEM.321-323.1719

Citation:

B. I. Noh and S. B. Jung, "Reliability of Flip Chip Package with Underfills under Thermal Shock", Key Engineering Materials, Vols. 321-323, pp. 1719-1722, 2006

Online since:

October 2006

Export:

Price:

$35.00

In order to see related information, you need to Login.