Thermo-Mechanical Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change

Abstract:

Article Preview

In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moiré interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Detailed global and local deformations of the package by temperature change are investigated and its effect on the frequency shift of the MEMS gyroscope is studied.

Info:

Periodical:

Key Engineering Materials (Volumes 324-325)

Edited by:

M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz

Pages:

227-230

DOI:

10.4028/www.scientific.net/KEM.324-325.227

Citation:

J. W. Joo, Y. C. Cho, J. H. Won, S. H. Choa, "Thermo-Mechanical Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change", Key Engineering Materials, Vols. 324-325, pp. 227-230, 2006

Online since:

November 2006

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.