Plastic Dissipation and Temperature Field around a Steady Running Crack


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Temperature field is formed due to heat dissipation when material is subjected to irreversible deformation. In this paper, the heat dissipation in the crack-tip plastic zone was considered. By considering the propagating crack-tip plastic zone as a running heat source and constructing a reasonable heat source density distribution function, the temperature field around a steady running crack was obtained. It is shown that temperature rise is dependent on the crack growth speed and the material parameters. The maximum temperature rise reaches to >50 oC in our example calculations for a steady running crack in PMMA.



Key Engineering Materials (Volumes 324-325)

Edited by:

M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz




W. B. Luo and T. Q. Yang, "Plastic Dissipation and Temperature Field around a Steady Running Crack", Key Engineering Materials, Vols. 324-325, pp. 895-898, 2006

Online since:

November 2006




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