Research on Fracture Behavior of a Cracked Film-Substrate Medium


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This study gives the problem of a crack in the film oriented perpendicular to the film-substrate interface with the crack tip terminating at the interface. Based on Beuth’s theory, three-dimensional model is simplified to plane strain problems, which obtains fracture mechanisms of a cracked film-substrate medium by applying the boundary element method(BEM). The method aptly resolves the problem involving stress concentration and, further, that this study develops the multi-region boundary element method and applies it to evaluate the cracked film-substrate medium. It shows that the stress intensity factor is affected by the different elastic mismatches and the thickness ratio of the film and the substrate. These results indicate: 1) The stress intensity factor has remarkable increased with the decrease of the thickness ratio of the film and the substrate. The effect of the fracture behavior of film is negligible when the thickness ratio of the film and the substrate is above 10, therefore, it is treated as thin film; 2) The stress intensity factor will decrease with the increase of α ( −1 pα p +1) for β = 0 and β =α / 4 , where α and β are called Dundurs parameters. What’s more, this paper studies the special condition of the film-substrate medium, which is the analysis of the fracture of the absence of any elastic mismatch between the film and the substrate, i.e.α=β=0, and revision of the formula of Xia and Hutchinson is put forward for the stress intensity factor of the deep crack problems by comparing to the former conclusions of Y.Murakami.



Key Engineering Materials (Volumes 324-325)

Edited by:

M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz




B. L. Liu and X. S. Bi, "Research on Fracture Behavior of a Cracked Film-Substrate Medium", Key Engineering Materials, Vols. 324-325, pp. 903-906, 2006

Online since:

November 2006




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