Tensile Damage Characterization in Nicalon Fiber Reinforced Ceramic Composites


Article Preview

Tensile failure behavior of ceramic matrix composites (CMCs) was characterized with nondestructive evaluation (NDE) techniques. Prior to the mechanical testing, infrared (IR) thermography was employed to obtain thermal diffusivity maps for CMC specimens. IR thermography also was used for quantitative analyses of the progressive damage and in-situ monitoring of the damage during tensile tests, while ultrasonic (UT) C-scans were used to present defect distributions of the composites. The thermal diffusivity map showed good consistency with ultrasonic C-scan results of CMC specimens. In this investigation, qualitative relationship between UT signatures and thermal diffusivity has been introduced, and the temperature changes of CMC specimens during tensile test have been measured. Moreover, the correlation between NDE results and fracture behavior of CMCs has been presented to understand tension fracture behavior of CMCs.



Key Engineering Materials (Volumes 326-328)

Edited by:

Soon-Bok Lee and Yun-Jae Kim




J. G. Kim, "Tensile Damage Characterization in Nicalon Fiber Reinforced Ceramic Composites", Key Engineering Materials, Vols. 326-328, pp. 1237-1242, 2006

Online since:

December 2006





[1] R.L. Lehman, S.K. El-Rahaiby, and J.B. Wachtman: Handbook on Continuous FiberReinforced Ceramic Matrix Composites (The Am. Ceram. Soc. 1995).

[2] Nondestructive Testing Handbook, 2 nd ed., Vol. 10, Nondestructive Testing Overview, S. Ness, C. N. Sherlock, P. O. Moore, and P. M. McIntire, ASNT, Inc., (1996).

[3] ASM Handbook: Nondestructive Evaluation and Quality Control, Vol. 17, (ASM International, 1992), p.231.

[4] J. Kim and P. K. Liaw, JOM, 50, 11, (1998).

[5] J. Kim, P.K. Liaw, D.K. Hsu, D.J. McGuire, R.A. Lowden, and T. Moudden, Nondestructive Evaluation and Materials Properties III, Edited by P.K. Liaw, O. Buck, R.J. Arsenault, and R.E. Green, Jr., The Minerals, Metals & Materials Society, 1997, p.55.

[6] J. Kim, P.K. Liaw, D.K. Hsu, and D.J. McGuire, Ceram. Engr. and Sci. Proc., 18, 1997, p.287.

[7] H. Wang, R.B. Dinwiddie and P.S. Gaal, Thermal Conductivity, 23, p.119.

[8] Sanjay Ahuja, William A. Ellingson, J. Scott Steckenrider, and Steven J. Koch, ASTM STP 1309, Michael G. Jenkins, Stephen T. Gonczy, Edgar Lara-Curzio, Noel E. Ashbaugh, and Larry P. Zawada, Eds., American Society for Testing and Materials, (1997).

[9] T.M. Besmann, B.W. Sheldon, R.A. Lowen, and D.P. Stinton, Science, 253, 1991, p.1104.

[10] Parker, W.J., Jenkins, R.J., Butler, C.P., and Abbott, G.L., Journal of Applied Physics, 32(9), 1961, p.1679.