Rectangular Microlens Array Having High Sag for Multi Chip LED Packaging
A novel rectangular shape microlens array having high sag for solid-state lighting is presented. The rectangular shape of proposed microlens can maximize the fill factor of silicon based light-emitting-diode (LED) packaging and minimize the optical loss through the reduction of unnecessary reflection at the same time. Microlens, which has high sag, over 3 75 μm and large diameter, over 3 mm can enormously enhance output optical extraction eff iciency. Moreover wafer level packaging technology is adopted to improve the aligning accu racy and mass production of LED packaging. This wafer level microlens array can be direc tly fabricated on LED packaging using replication method. It has many advantages in optica l properties, low cost, high aligning accuracy, and mass production.
Soon-Bok Lee and Yun-Jae Kim
W. K. Jeung et al., "Rectangular Microlens Array Having High Sag for Multi Chip LED Packaging", Key Engineering Materials, Vols. 326-328, pp. 1491-1494, 2006