Interfacial Residual Stress Measurement of SiC/Epoxy Composites by Microphotoelastic Method

Abstract:

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Interfacial residual stresses play an important role in the mechanical properties. In this paper, the interfacial residual stresses of SCI/Epoxy composites were determined using a novel technique-microphotoelastic method. The thermal residual stress field was also numerically simulated using a finite element software MSC.MARC. The difference and the similarities between the experimental results and the simulation of FEM analysis were discussed and the availability of the method was preliminarily certified.

Info:

Periodical:

Key Engineering Materials (Volumes 326-328)

Edited by:

Soon-Bok Lee and Yun-Jae Kim

Pages:

273-276

DOI:

10.4028/www.scientific.net/KEM.326-328.273

Citation:

X. W. Yang et al., "Interfacial Residual Stress Measurement of SiC/Epoxy Composites by Microphotoelastic Method", Key Engineering Materials, Vols. 326-328, pp. 273-276, 2006

Online since:

December 2006

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Price:

$35.00

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