Interfacial Residual Stress Measurement of SiC/Epoxy Composites by Microphotoelastic Method
Interfacial residual stresses play an important role in the mechanical properties. In this paper, the interfacial residual stresses of SCI/Epoxy composites were determined using a novel technique-microphotoelastic method. The thermal residual stress field was also numerically simulated using a finite element software MSC.MARC. The difference and the similarities between the experimental results and the simulation of FEM analysis were discussed and the availability of the method was preliminarily certified.
Soon-Bok Lee and Yun-Jae Kim
X. W. Yang et al., "Interfacial Residual Stress Measurement of SiC/Epoxy Composites by Microphotoelastic Method", Key Engineering Materials, Vols. 326-328, pp. 273-276, 2006