Effects of Packaging Induced Stress on MEMS Devices and Its Improvements


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In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.



Key Engineering Materials (Volumes 326-328)

Edited by:

Soon-Bok Lee and Yun-Jae Kim




S. H. Choa et al., "Effects of Packaging Induced Stress on MEMS Devices and Its Improvements", Key Engineering Materials, Vols. 326-328, pp. 529-532, 2006

Online since:

December 2006




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