Effects of Packaging Induced Stress on MEMS Devices and Its Improvements


Article Preview

In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.



Key Engineering Materials (Volumes 326-328)

Edited by:

Soon-Bok Lee and Yun-Jae Kim




S. H. Choa et al., "Effects of Packaging Induced Stress on MEMS Devices and Its Improvements", Key Engineering Materials, Vols. 326-328, pp. 529-532, 2006

Online since:

December 2006




[1] R.L. Liu, B. Paden and K. Turner, J. Microelectromech. Syst. Vol. 11, (2002), p.403.

[2] G. Li and A. Tseng, IEEE Trans. on Electronics Packaging Manufacturing, Vol. 24, (2001) p.18.

[3] T. Rogers and J. Kowal, Sensors Actuators, Vol. A 46-47, (1995), p.113.

[4] Y.S. Oh, et al., Sensors Actuators, Vol. A64, (1998), p.51.

[5] B.L. Lee, et al., in : Proc. IEEE Int. Conf. on Robotics & Automation(2001), Seoul, Korea, p.3412.

[6] J.S. Han and B.M. Kwak, J. Micromech. Microeng. Vol. 11, (2001), p.662.

[7] G. Kelly, et al. in: Proc. IEEE Electron. Comp. Technol. Conf. (1994).

Fetching data from Crossref.
This may take some time to load.