Study on Structure Transformation of Si Wafer in Grinding Process


Article Preview

In this paper, the surface and subsurface of silicon wafers ground by different wheels have been studied. In the conventional grinding with diamond wheels, it is shown from the top that the subsurface of wafer consists of amorphous Si, followed by a thin damaged layer, strained crystal with a large compressive residue stress, and then the bulk material in single crystal. In a severe condition which causes grinding burn, part of amorphous Si is re-crystallized to form a poly-crystal Si, and part of amorphous Si possibly reacts with oxygen to form SiO2. This phenomenon becomes more pronounced in the backgrinding process with a fine grit diamond wheel when the conditions are improperly selected. In order to obtain a defect-free crystal Si structure in grinding, authors have proposed a new chemo-mechanical grinding (CMG) process which enables to remove Si from wafer but with no structure transformation induced to its surface.



Edited by:

Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki




L. B. Zhou et al., "Study on Structure Transformation of Si Wafer in Grinding Process", Key Engineering Materials, Vol. 329, pp. 373-378, 2007

Online since:

January 2007




[1] T.G. Bifano, T.A. Dow and R. O Scattergood: Ductile-Regime Grinding: A New Technology for Machining Brittle Materials, ASME J. Eng'g for Industry, Vol. 113/2(1991), pp.184-189.


[2] L. Zhang and I. Zarudi: Towards a Deeper Understanding of Plastic Deformation in Single crystal Silicon, Int'l J. of Mechanical Sciences, Vol. 43 (2001), p.1985-(1996).


[3] P. Halahan and T. Schraub: Backgrinding technologies for thin-wafer production webpage, http: /www. chipscalereview. com/issues/0102/f6_01. html.

[4] J. Chen and I. D. Wolf: Study of damage and stress induced by backgrinding in Si wafers, Semiconductor Science and Technology, Vol. 18(2003), pp.261-268.


[5] Renishaw application note: Imaging of silicon stress in microelectronics using Raman spectroscopy, Issue 1. 0(2003).

[6] L. Zhou, J. Shimizu and H. Eda: A novel fixed abrasive process: chemo-mechanical grinding technology, Int. J. Manufacturing Tech. and Management, Vol. 7, No. 5/6(2005).