Experimental Study on New Bonding Materials for Developing Nano-Grinding Plates


Article Preview

This paper describes a method for experimental development of a novel fixed abrasive nano-grinding plate (FAG-plate) which is proposed for lapping some rigid brittle materials, such as quartz crystal and silicon. The FAG plate is developed with ultraviolet-cured resin by rapid prototyping technology. The analysis shows that such FAG-plate can keep its grinding ability constant and continuous and it can make the roughness of machined surface reach to nanometer level. Based on experimental comparisons with conventional free abrasive slurry lapping plates, the lapping process using FAG-plate has several distinct advantages. One is that the machining efficiency is significantly improved. The second is that it improves the surface roughness of machined work-pieces, although it decreases the flatness tolerance of materials. Furthermore, the fixed abrasive nano-grinding plate is made by the new bonding materials- ultraviolet curing resin and thus the fabrication of FAG-plate is convenient and economical.



Edited by:

Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki




W. Peng et al., "Experimental Study on New Bonding Materials for Developing Nano-Grinding Plates", Key Engineering Materials, Vol. 329, pp. 489-494, 2007

Online since:

January 2007




[1] H.H. Gatzen, J.C. Maetzig and M.K. Schwabe. IEEE Trans 32 (1996), pp.1843-1849.

[2] H.H. Gatzen and J.C. Maetzig Gatzen. Journal of the ASPE Vol. 21, No 2/3 pp.134-139.

[3] P. van der Velden. Microelectronic Engineering. 50 (2000) pp.41-46.

[4] D. Austin Kam: Precision Fabrication And Development Of Charging And Testing Methods Of Fixed-Abrasive Lapping Plates. (Dissertation, U.S. A 2002).

[5] J. Choi and H. Jeong. Journal of Machine Tools and Manufacture, Vol. 44(2004), pp.1163-1169.

[6] Y. Tomita and H. Eda. Wear, Vol. 195(1996), pp.74-80.

[7] T. Tanaka,Y. Isomo. Journal of materials Processing Technology, Vol. 113(2001), pp.385-388.

[8] S. Lee, Y. Tani, T. Enomoto, K. Yanagihara and W. Peng: Transactions of the Japan Society of Mechanical Engineers Vol. 69(c) (2002) pp.2180-2184.

[9] W. Peng and C.Y. Yao: Journal of Materials Processing Tech. Vol. 129(1)(2002) pp.377-381.

[10] C.Y. Yao, W. Peng and T. Gao: Key Engineering Materials Vol. 259(1) (2004).