Composite Materials for Thermal Expansivity Matching and High Heat Flux Thermal Management

Abstract:

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A description is given of a possible solution of an important practical problem in microelectronics, namely producing a material of thermal expansion coeffiecient to equal that of silicon.

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Periodical:

Key Engineering Materials (Volumes 334-335)

Edited by:

J.K. Kim, D.Z. Wo, L.M. Zhou, H.T. Huang, K.T. Lau and M. Wang

Pages:

1017-1020

DOI:

10.4028/www.scientific.net/KEM.334-335.1017

Citation:

A. Kelly "Composite Materials for Thermal Expansivity Matching and High Heat Flux Thermal Management", Key Engineering Materials, Vols. 334-335, pp. 1017-1020, 2007

Online since:

March 2007

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Price:

$35.00

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