Characterization Methodology of the Interface in Multilayer Composites


Article Preview

The quality of the interfaces in multilayer composites is a critical issue in the reliability testing of the composite product during the manufacturing process and in-service. Weak interfaces have often gone undetected and may become potentially defective at a later stage. One example is the interface between mold compound and silicon (MC/Si) in IC packaging. There is a desire to study the interface quality quantitatively, so the potential defective area can be evaluated and identified early. In this paper, a nondestructive evaluation methodology is proposed to measure the available strength of the interface by using ultrasonic reflection coefficients. It is known that interface degradation can be either due to poor manufacturing process and stress loading. Characterization of the interface quality of the MC/Si interface is first conducted by measuring longitudinal ultrasonic wave reflections from the interface samples fabricated under varying conditioning processes that simulate the degradation. A combined test that measures the reflection coefficient of the interface under stress load has also been conducted to quantify the effect of the load. Finally, it is shown that the overall effect on the reflection coefficient and available strength of the interface is derived and can be used as a quantitative indicator.



Key Engineering Materials (Volumes 334-335)

Edited by:

J.K. Kim, D.Z. Wo, L.M. Zhou, H.T. Huang, K.T. Lau and M. Wang




H.C. Yeo et al., "Characterization Methodology of the Interface in Multilayer Composites", Key Engineering Materials, Vols. 334-335, pp. 1041-1044, 2007

Online since:

March 2007




[1] N. Guo, J. Abdul, H. Du, and B.S. Wong, J. Adhes. Sci. Technol., 16 (2002) 1261-1279.

[2] J. Abdul, Y. Wang, N. Guo, A. -U. Rehman, and K.C. Chan, IEEE Trans. Electron. Packag. Manuf., 26 (2003) 221-227.

[3] Otsuka, M., et al., (1998), IEEE Electronic Components and Technology Conference, 1167-1172.

[4] Schmidt R., et al., (1998), IEEE/CPMT Electronics Packaging Conference.

[5] H.C. Yeo, et al., (2006), Microelectronics Reliability, submitted.