Interformational Exfoliation of Ti3Al2 Induced by Cu

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An interformational exfoliation behavior of the layered Ti3AlC2 induced by copper was firstly investigated via a “Cu-Ti3AlC2-Cu” sandwich sample infiltration-sintered at 1100oC to 1200oC. It was found that the molten Cu accelerates Ti3AlC2 to decompose, induces the interformational exfoliation to generate, and consequently forming a sub-micro-layered structure making up of TiC0.67 layers and Cu-Al alloy layers within a Ti3AlC2 grain. This interformational exfoliation behavior can be attributed to a topotactic mechanism due to the outward diffusion of Al the entering of Cu.

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Periodical:

Key Engineering Materials (Volumes 336-338)

Edited by:

Wei Pan and Jianghong Gong

Pages:

1371-1373

DOI:

10.4028/www.scientific.net/KEM.336-338.1371

Citation:

M. X. Ai et al., "Interformational Exfoliation of Ti3Al2 Induced by Cu", Key Engineering Materials, Vols. 336-338, pp. 1371-1373, 2007

Online since:

April 2007

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$38.00

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