Interformational Exfoliation of Ti3Al2 Induced by Cu
An interformational exfoliation behavior of the layered Ti3AlC2 induced by copper was firstly investigated via a “Cu-Ti3AlC2-Cu” sandwich sample infiltration-sintered at 1100oC to 1200oC. It was found that the molten Cu accelerates Ti3AlC2 to decompose, induces the interformational exfoliation to generate, and consequently forming a sub-micro-layered structure making up of TiC0.67 layers and Cu-Al alloy layers within a Ti3AlC2 grain. This interformational exfoliation behavior can be attributed to a topotactic mechanism due to the outward diffusion of Al the entering of Cu.
Wei Pan and Jianghong Gong
M. X. Ai et al., "Interformational Exfoliation of Ti3Al2 Induced by Cu", Key Engineering Materials, Vols. 336-338, pp. 1371-1373, 2007