Copper-coated alumina powders were prepared by a chemical plating method. The processing parameters such as compositions of plating solution, dispersants and passivants were optimized to obtain high-quality Cu-coated alumina powders. The phase composition, surface morphology and granularity of the coated powders were analyzed. Experimental results showed that the alumina powders coated with copper can be successfully prepared by the chemical plating method at room temperature, and the additions of dispersant and passivant can sufficiently improve the dispersity of powders and can depress the oxidation of copper layers precipitated from the plating solution. The granularity of alumina powders is increased by about 60 nm after being coated with the copper layer.