High Speed Lapping of SiC Ceramic Material with Fixed Abrasive

Abstract:

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An experimental investigation is carried out to machine SiC ceramic material through method of high speed plane lapping with fixed abrasive. The results show that the material removal mechanism and the surface roughness are chiefly related to the granularity of abrasive and the lapping pressure for the brittle materials such as SiC ceramic. It is easily realized to machine SiC ceramic material in ductile mode with a high efficiency and a low cost using W3.5 grit under a lapping pressure of 0.1MPa and then a smooth surface with surface roughness of Ra 2.4nm can be achieved.

Info:

Periodical:

Key Engineering Materials (Volumes 336-338)

Edited by:

Wei Pan and Jianghong Gong

Pages:

1458-1460

DOI:

10.4028/www.scientific.net/KEM.336-338.1458

Citation:

X. H. Yang et al., "High Speed Lapping of SiC Ceramic Material with Fixed Abrasive", Key Engineering Materials, Vols. 336-338, pp. 1458-1460, 2007

Online since:

April 2007

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Price:

$35.00

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