Features of Bonded Interface and Impedance and Power of PZT Transducer

Abstract:

Article Preview

A series of experiments is carried out on the characteristics at the wedge bond interface. Bond lift-off characteristics are studied by using Scanning Electron Microscope with EDS-test. The characteristics of input impedance of PZT transducer are analyzed by the driving electric signal measured by Oscilloscope. Results show that the pattern of partially bonded material at the interface of ultrasonic wedge bonds exposed by peeling underdeveloped bonds simulates a torus with an unbonded central region. For the same machine variables, the input impedance and transforming power of the first wedge bond are greater than that of the second wedge bond. Some conclusions drawn by analyzing the input impedance and the power of PZT consist with the results gotten by testing microstructures at the interface.

Info:

Periodical:

Edited by:

Shen Dong and Yingxue Yao

Pages:

119-125

Citation:

X. Chen et al., "Features of Bonded Interface and Impedance and Power of PZT Transducer", Key Engineering Materials, Vol. 339, pp. 119-125, 2007

Online since:

May 2007

Export:

Price:

$38.00

[1] J. Tsujino, H. Yoshihara, K. Kamimoto and et al: Ultrasonics, Vol. 36 (2002) No. 2, pp.59-65.

[2] G.G. Harman: Wire Bonding in Microelectronics (McGraw-Hill Publishers, second edition), Chapter 2, (1997), pp.18-23.

[3] G.G. Harman: IEEE Trans. Parts Hybrids Manuf. Technol. (1990) No. 13, pp.176-181.

[4] S. Suman, M. Gaitan, Y. Joshi and et al: Georgia Institute of Technology (2002), pp.1-6.

[5] J. Schwizer, M. Mayer, D. Bolliger and et al: IEEE International Electronic Manufacturing Technology Symposium (IEMT), Austin, Texas, Vol. 18-19 (October, 1999), pp.108-114.

[6] I.W. Qin, P. Bereznycky and D. Doerr: Kulicke & Soffa, (2003) A1-A10.

[7] P. Elenius and L. Levine: ChipScale Reiew, (2000) No. 8, pp.81-87.

[8] S.Y. Kang, P.M. Williams, T.S. Mclaren and et al: Materials Chemistry and Physics, (1995) No. 42, pp.31-37.

[9] C.H. Wang and Andrew S. Holmes: IEEE Transaction on Electronics Packaging Manufact., Vol. 24 (2001) No. 2, PP. 109-114.

[10] Q. Tan, S. Brian, J. Leonard and et al: IEEE Ultrasonics Symposium, (1998), pp.1-8.

[11] V. Snitka, A. Ulcinas, M. Rackaitis and et al: Ultrasonic, (1998) No. 36, pp.499-503.

[12] W. Gao, B.R. Tittmann and C. Miyasaka: IEEE Ultrasonics Symposium, (1999) pp.601-604.

[13] J.E. Krzazowski: IEEE Transaction on Components, Hybrids, and manufacturing technology, Vol. 13 (1995) No. 1, pp.76-182.

[14] C.M. Tan, Z.H. Gan: IEEE Transactions on Device and Materials Reliability, Vol. 3 (2003) No. 2, pp.44-50.

[15] Q. Qi and G.J. Brereton: IEEE Transaction on Ultrasonics, Perroelectrics, and Frequency Control, Vol. 42 (1995) No. 4, pp.619-62.