Pattern Shifting Analyses of Micro-Structures of IC Package

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Pattern shift is one of the main failures of micro-electronics. In this paper, the influence of plastic deformation values of micro-structures of IC packages on the pattern shift of metal lines is studied by maximum plastic strain theory using a certain 2D FEM model with different design parameters, “d”, “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al”. For different critical process step, the final process temperature is acted as a representative parameter to analyze its impact. Furthermore, Response Surface Model (RSM) of plastic strains is established using any two design parameters. Results show that “w”, “t_epo”, “t_Teos”, “t_glue” “sy_glue” and “sy_al” will have different influence on pattern shifting while “d” have little impact.

Info:

Periodical:

Key Engineering Materials (Volumes 340-341)

Edited by:

N. Ohno and T. Uehara

Pages:

1333-1338

Citation:

Y. T. He et al., "Pattern Shifting Analyses of Micro-Structures of IC Package", Key Engineering Materials, Vols. 340-341, pp. 1333-1338, 2007

Online since:

June 2007

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$38.00

[1] R.B. R van Silfhout, G. Q Zhang, et al, State-of-the-Art on Thermo-Mechanical Modelling of IC Back-End Processes, Proc. of EuroSIME 2001, Paris, France.

[2] Dasgupta, Abhijit. The Physics-of-Failure Approach at the University of Maryland for the Development of Reliable Electronics, Proc. of EuroSIME 2002, Paris, France.

[3] Bisschop, J. Failure Mechanisms in Plastic Package IC's, Proc. of EuroSIME 2002, Paris, France.

[4] Y.T. He, G.Q. Zhang, etc. Cracking Prediction of IC's Passivation Layer using J-integral, ICEPT2003, Shanghai, P.R. China.

[5] Du, Yong, Wang, Guotao etc. Thermal stress and Debonding in Cu/Low k Damascene Line Structures, 2002 Electronic Components and Technology Conference.

DOI: https://doi.org/10.1109/ectc.2002.1008201

[6] Y.T. He, G.Q. Zhang, W.D. van Driel, et al. The Influence of Leadframe on Passivation Cracks Growth. In: Keyun Bi, et al. (ed. ), Proc. 5th ICEPT, Shanghai, (2003), pp.430-437.

[7] H.P. Stehouwer, den Hertog D., 1999, Simulation-based design optimisation: methodology and applications (extended abstract), Proc. of the First ASMO UK / ISSMO Conference on Engineering Design Optimization, Ilkley, UK.

[8] V.V. Toropov, A.A. Filatov, and Polynkine, A.A., Multiparameter structural optimization using FEM and multipoint explicit approximations, Structural Optimization(1993), Vol. 6, p.7.

DOI: https://doi.org/10.1007/bf01743169

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