Mechanical Properties of the Intrinsically Conductive Polymer Poly(3,4- Ethylenedioxythiophene) Poly(Styrenesulfonate) (PEDOT/PSS)


Article Preview

In recent years there have been vast efforts to establish organic electronic devices. A key property of such devices is the possibility to fabricate them on flexible substrates. As the layers are mechanically stressed during bending, the knowledge of mechanical properties of the materials used will become very important. In this research the mechanical properties of the intrinsically conductive and widely used polymer PEDOT/PSS were investigated using a micro tensile test setup. The tensile tests showed values for Young’s Modulus in the range from 1 GPa to 2.7 GPa, for the tensile strength in a range from 25 MPa to about 55 MPa and for the total strain at break between 3% and 5%, all of them depending on relative humidity.



Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim




U. Lang and J. Dual, "Mechanical Properties of the Intrinsically Conductive Polymer Poly(3,4- Ethylenedioxythiophene) Poly(Styrenesulfonate) (PEDOT/PSS) ", Key Engineering Materials, Vols. 345-346, pp. 1189-1192, 2007

Online since:

August 2007





[1] E. Mazza, G. Danuser, J. Dual: Microsystem Technologies Vol. 2, No. 2 (1996), pp.83-91.

[2] G. Simons, J. Dual: Proceedings of Materialsweek 2001, International Congress Centre Munich, Oct. (2001).

[3] G. Simons, C. Weippert, J. Dual, J. Villain: Materials Science and Engineering A Vol. 416 No. 1-2 (2006), pp.290-299.

[4] A. Elschner, F. Bruder, H.W. Heuer, F. Jonas, A. Karbach, S. Kirchmeyer, S. Thurm: Synthetic Metals Vol. 111 (2000), pp.139-143.

DOI: 10.1016/s0379-6779(99)00328-8

[5] J.Y. Ouyang, T.F. Guo, Y. Yang, H. Higuchi, M. Yoshioka, T. Nagatsuka: Advanced Materials Vol. 14, No. 12 (2004), pp.915-918.

[6] N. Stutzmann, R.H. Friend, H. Sirringhaus: Science Vol. 299 (2003), pp.1881-1884.

[7] D. Li, L.J. Guo: Applied Physics Letters Vol. 88, No. 6 (2006).

[8] ISO 527-3: 1995 + Corr 1: 1998 + Corr 2: (2001).

[9] U. Lang, J. Dual: POLYTRONIC 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, ISBN 0-7803-8744-9 (2004), pp.230-236.

DOI: 10.1109/polytr.2004.1402767

Fetching data from Crossref.
This may take some time to load.