Effect of Heating Rate on Al Bonding in Air by Inserted A5056 Disk


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Al bonding in air by inserted A5056 was investigated in this study. Heating rate in thermal history of bonding process may have the relation with the growth of Al oxide film and the deformation of bonding surface by softening. Both of phenomena affect the joinability and the mechanical properties of bond. Al bonding in air was carried out by several heating rate. Growth of Al oxide film significantly suppressed the progress of bonding in air by low heating rate, 1K/s. Decrease of deformation of bonding surface suppressed also the progress of bonding by high heating rate, 10K/s. In case of medium heating rate, 5K/s, good joinabilty of Al bonding in air was obtained by the medium growth of oxide film and the deformation of bonding surface.



Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim




H. Kawakami et al., "Effect of Heating Rate on Al Bonding in Air by Inserted A5056 Disk", Key Engineering Materials, Vols. 345-346, pp. 1457-1460, 2007

Online since:

August 2007




[1] A.S. Zuruzi, H. Li, G. Dong: Effect of surface roughness on the diffusion bonding of Al Alloy 6061 in air, Material Science and Engineering, A270(1999), 244-248.

DOI: https://doi.org/10.1016/s0921-5093(99)00188-4

[2] C.S. Lee, H. Li, R.S. Chandel: Vacuum-free Diffusion Bonding of Aluminum Metal Matrix Composite, Journal of Material Processing Technology, 89-90(1999), 326-330.

DOI: https://doi.org/10.1016/s0924-0136(99)00144-2

[3] D.S. Duvall, W.A. Owczarski, D.F. Paulonis: TLP bonding: a New Method for Joining Heat Resistant Alloys, Welding Journal, Vol. 53, No. 4(1974), 203-214.

[4] Toshio Enjo, Kenji Ikeuchi: Diffusion Welding of Al-Cu-Mg Series 2017 Alloy, Quarterly Journal of the JWS, Vol. 2, No. 4(1984), 599-605. (in Japanese).

DOI: https://doi.org/10.2207/qjjws.2.599

[5] Osamu Ohashi, Ken Sasabe: Effect of Alloying Element on Behavior of Oxide Film at Diffusion-welded Interface of Aluminum Alloys, Quarterly Journal of the JWS, Vol. 7, No. 4(1989), 449-455. (in Japanese).

[6] Hiroshi Kawakami, Jippei Suzuki, Masanori Fujiwara, Junya Nakajima, Keiko Kimura: Evaluation for Al/Cu Bonding by Liquefaction after Solid Phase Diffusion in the Air, Proc. of the 2005 Spring Annual Meeting of Korean Welding Society(2005).

DOI: https://doi.org/10.2207/qjjws.25.24

[7] Hiroshi Kawakami, Masanori Fujiwara, Junya Nakajima, Toshiharu Kawabe, Jippei Suzuki: Behavior of Mg in Al/Cu Diffusion Liquefaction Bond, Proc. of The First South-East Asia IIW Congress(2006), 232-243.

[8] Kenji Ikeuchi, Keiko Kotani and Fukuhisa Matsuda: Behavior of Oxide at Diffusion-Bonded Interface of Al-Mg-Si Series 6063 Alloy, Quarterly Journal of the JWS, 14-1(1996), 122-128. (in Japanese).

DOI: https://doi.org/10.2207/qjjws.14.122