Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials


Article Preview

Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and heat treatment process. These specimens were evaluated the formability and bonding strength of Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film formed on copper surface during heat treatment at 673K~773K. Diffusion bonding was observed at the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about 10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nanosized crevice in reacted region of Al/STS interfaces.



Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim




D. S. Bae et al., "Interface Properties of Copper/Aluminum/Stainless Steel Clad Materials", Key Engineering Materials, Vols. 345-346, pp. 1497-1500, 2007

Online since:

August 2007




[1] Y. Yamamura and T. Fukuda: J. JSTP Vol. 42(2001-3), p.40.

[2] M. Abbasi, A. Karimi Taheri and M.T. Salehi: J. Alloys and Compounds Vol. 319(2001), p.233.

[3] O. Yilmaz and H. Celik: J. Mater. Proc. Tech. Vol. 141(2003), p.67.

[4] K.Y. Rhee, W.Y. Han, H.J. Park and S.S. Kim: Mater. Sci. and Eng. A Vol. 384(2004), p.70.

[5] K. Raghnukandan: J. Mater. Proc. Tech. Vol. 139(2003), p.573.

[6] M. Braunovic, N. Aleksandrov: IEEE Trans. Paper No. CHMT-93-10(1993), p.261.

[7] V.L.A. Silveria, A.G. Mury: J. Microstruct. Sci. Vol. 14(1987), p.277.