Superplastic Characteristics and Diffusion Bonding of Ti-6Al-4V Alloy

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It is known that Ti-6Al-4V alloy is one of the excellent candidates for aerospace structure due to their high specific strength.However, its higher cost and low formability relative to other materials tend to limit the wide usage of the material.The purpose of this study is to characterize the superplasticity of this alloy so to obtain materials and process parameters for superplastic forming and diffusion bonding for industrial application. High temperature tensile tests was carried out at the strain rate range of 10-4 to 10-2 s-1 and temperature range of 1123°C to 1223°C. According to the results of the experiment, the optimum diffusion bonding condition was obtained at 1148°C, applying pressure of 4MPa for 1 hour in argon gas environment, which condition is more practical than expensive vacuum condition. It is shown that at the optimum condition for diffusion bonding with parent metal, the oxide film becomes unstable and the oxygen is diffused into the bulk. At this condition, the mechanical and microstructural integrity at the bonding interface was observed in a sandwich structure and a heavy block of titanium part from massive diffusion bonding process.

Info:

Periodical:

Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim

Pages:

549-552

Citation:

H. S. Lee et al., "Superplastic Characteristics and Diffusion Bonding of Ti-6Al-4V Alloy", Key Engineering Materials, Vols. 345-346, pp. 549-552, 2007

Online since:

August 2007

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$38.00

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[2] H.S. Lee, J.H. Yoon and Y. Moo. Yi, Solid State Diffusion Bonding of Titanium alloys, Advances in Nanomaterials and Processing, Trans Tech Publications, Stafa-Zurich, Switzerland, 2006, pp.1429-1432.

DOI: https://doi.org/10.4028/3-908451-31-0.1429

[3] Standard Guide for Preparation of Metal Surfaces for Adhesive Bonding, ASTM D 2651-01.

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[6] Y. Mizuno, F.K. King, Y. Yamaochi, et al., 15th International Vacuum Congress, San Francisco, U.S.A., October 28, (2001).

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