A study on MicroCantilever Deflection for the Infrared Image Sensor using Bimetal Structure

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This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control.

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Periodical:

Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim

Pages:

785-788

Citation:

H. S. Kim et al., "A study on MicroCantilever Deflection for the Infrared Image Sensor using Bimetal Structure", Key Engineering Materials, Vols. 345-346, pp. 785-788, 2007

Online since:

August 2007

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$38.00

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