Development of Bellows Type Vertical Micro Contact Probe

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In the semiconductor inspection, number of pads at unit area is increasing and pad array have become irregular 2-dimensional. So we develop a bellows type micro contact probe. Our micro contact probe is a vertical-type micro contact probe for area arrays and narrow pitch electrode pads. We choose bellows type micro contact probe to prevent stress concentration. Our design targets are 120 um pad pitch, 20-50 um OD(over drive) and over 5 mN reaction force. In this research, micro contact probe is made by electroplating(Ni-Co). structural analysis is accomplished by FEM. And characterization of micro contact probe is done by our own mechanical tester. So material property is measured for structural analysis and structural analysis result will be compared with experimental result.

Info:

Periodical:

Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim

Pages:

789-792

Citation:

J. Y. Kim et al., "Development of Bellows Type Vertical Micro Contact Probe", Key Engineering Materials, Vols. 345-346, pp. 789-792, 2007

Online since:

August 2007

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$38.00

[1] J.H. Kim, S.I. Chu, S.H. Lee, J.W. Shim, J.H. Park, K.T. Kim and S.W. Moon, Fabrication and Mechanical Characterization of MEMS Vertical Type Probe Tip for Micro Sized Pad's Measurement, 8th Korea MEMS Conference , pp.533-536.

DOI: https://doi.org/10.1109/memsys.2007.4432969

[2] T. Haga, Development of Micro Contact Probe, SEI Technical Review, N55, January (2003).

[3] Kataoka, Multi layer electroplated micro spring array for MEMS probe card, MEMS 2004 , 17th IEEE Conference, pp.733-736, (2004).

DOI: https://doi.org/10.1109/mems.2004.1290689

[4] B.H. Kim, D.Y. Chung, C.H. Chung, T.U. Chunk, S.H. Seok and K.J. Chun, A vertically guided MEMS probe card with deeply recessed trench-type cantilever, MEMS 2006, 18th IEEE Conference, pp.271-274.

DOI: https://doi.org/10.1109/memsys.2005.1453919

[5] S.H. Goods, Electrodeposited nickel-manganese: an alloy for microsystem applications, Microsystem Technologies, v10, n6-7, (2004).

[6] J.Y. Kim, H.J. Lee, H.J. Choi, S.J. Lee, S.W. Moon, Design, Fabrication and Mechanical Characterization of Vertical Micro Contact Probe, IEEE Sensors 2006 Conference, Taegu, (2006).

DOI: https://doi.org/10.1109/icsens.2007.355835