Microstructures and Mechanical Properties of Sn-9Zn-xGa Alloy

Abstract:

Article Preview

Info:

Periodical:

Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim

Pages:

85-88

Citation:

F. Y. Hung et al., "Microstructures and Mechanical Properties of Sn-9Zn-xGa Alloy", Key Engineering Materials, Vols. 345-346, pp. 85-88, 2007

Online since:

August 2007

Export:

Price:

$38.00

[1] J. M. Song, G. F. Lan, T. S. Lui and L. H. Chen, Scripta Materialia, vol. 48, 1047-1051(2003).

[2] C. M. L. Wu, C. M. T. Law, D. Q. Yu and L. Wang, J. of Electronic materials, vol. 32, no. 2, 63-69 (2003).

[3] D. Q. Yu, J. Zhao and L. Wang, "Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements, Journal of alloys and compounds, 366 (2004) 170-175.

DOI: https://doi.org/10.1016/j.jallcom.2004.01.012

[4] B. Salam, C. Virseda, H. Da, N. N. Ekere and R. Durairaj, Reflow profile study of the Sn-Ag-Cu solder, Soldering and Surface Mount Technology, vol. 16, no. 1 (2004) 27-23.

[5] P. Breuil, C. Pijolat and R. Lalauze, Properties of tin dioxide films as gas sensors, Silicates Industriels, vol. 55, no. 3/4, (1990) 91-94.

[6] K. L. Lin and C. L. Shih: J. Electron. Mater. 32 (2003)95-100.

[7] J. M. Song ,G. F. Lan , T. S . Lui and L. H. Chen : Scr. Mater. 48(2003) 1047-1051.

[8] K. I. Chen and K. L. Lin : J Electron. Mater. 31 (2002)861-867.

[9] J. S. Hwang , Z. Guo and H. Koenigsmann : Soldering and Surface Mount Technology 13/2 (2001) 7-13.

[10] Smithells Metals Reference Book, eighth edition, The Materials Information Society, edited by W. F. Gale and Totemeier, chap11.