The Mechanical Behavior of Materials X

The Mechanical Behavior of Materials X

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this collection was to gather together the latest information on the mechanical behavior of materials. The volumes cover the progress made in all aspects of the mechanical behavior of materials, seen from both the macroscopic and microscopic viewpoints.

Keywords:
Taking 685 abstracts, submitted from 31 countries, 482 papers from 28 countries were then selected and subjected to a strict peer-review process. The range of materials of interest, covered by these carefully-selected papers, spans both industrial materials, e.g., metals, alloys, polymers, ceramics and composites, and the more advanced materials currently under development.
The collection will be of interest to users, producers and researchers, whether engineers or scientists, who have a common interest in any aspect of materials behavior.

Review from Ringgold Inc., ProtoView: The 482 papers of this proceedings were first presented at the 10th International Conference on the Mechanical Behavior of Materials, held in Busan, Korea, in May 2007 and organized by the Korean Institute of Metals and the Korean Society of Mechanical Engineers. With scientists participating from 28 countries, these two volumes contain the current research in the field from an international perspective. The papers are grouped into 17 sections, including deformation behavior, fatigue, fracture and fracture mechanics, creep and superplasticity, failure mechanism and analysis, and nanostructured polymers and polymer nanocomposites. Individual paper topics include viscoelastic analysis of adhesively bonded double-lap joint, the mechanical properties of 91% tungsten alloy, and prevention of dicing-induced damage in semiconductor wafers. Both keyword and author indexes are provided.

Info:

ISBN-13:
978-0-87849-440-8
Editors:
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
Pages:
1658
Year:
2007
Edition:
2 softcover-volumes

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