High purity alumina/stainless steel joints were produced via activated molybdenummanganese (Mo-Mn) route using 72Ag-28Cu solder. Microstructures of the metallized ceramic and joint sections were observed by scanning electron microscopy. Joint strength was tested by shear-loading method. Some process factors were characterized and analyzed, which include temperature, holding time and heating and cooling rate in ceramic metallization process. The effects of Ni plating and succedent annealing were also investigated. Experimental results show that, migration of glassy phases is the main mechanism of the ceramic metallization. Glass migration direction is from metallizing layer to ceramic side. In the ranges of temperature and holding time of metallization, joint strength firstly increases and then falls with temperature raising and time extending. More fully sintered metallizing layer can be obtained while the temperature increases from 1200oC to 1500oC, and the time prolongs from 30min to 60min. Over-sintering of the metallizing layer will take place with metallizing temperature of 1600 oC and overlong holding time of 70min, which reduces the joint strength. The slower heating and cooling rate, and the annealing after Ni plating both help enhance the seal strength, due to relieving or eliminating interlayer residual thermal stress. However, too slow heating and cooling rate, such as 5 oC /min, is equivalent to overlong holding time and finally also decline the strength. A thin Ni coating helps solder wet metallizing surface, and stops solder erode metallizing layer.