Comparison of Reliability of Solder Joints by FORM and SORM


Article Preview

The difference in the Coefficient of Thermal Expansion (CTE) between the chip and the substrate generate thermal displacement in the solder joint. It seems to be a main cause of failure in the solder joint when the chip and the substrate are heated repeatedly. The failure of the solder joints by thermal fatigue is known to be influenced by varying boundary conditions such as the difference in CTE, the height of solder, the Distance of the solder joint from the Neutral Point (DNP) and the temperature variation. In this paper, the effects of varying boundary conditions on the failure probability of the solder joint are studied by using the probabilistic approach methods such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM).



Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie




O. S. Lee et al., "Comparison of Reliability of Solder Joints by FORM and SORM", Key Engineering Materials, Vols. 353-358, pp. 2593-2596, 2007

Online since:

September 2007




[1] R. R. Tummala: Fundamentals of Microsystems Packaging, (McGrawhill, 2001).

[2] J. H. Lau: Solder Joint Reliability Theory and Application(Van Nostrand Reinhold, 1991).

[3] S. Mahadevan and A. Haldar: Reliability Assessment Using Stochastic Finite Element Analysis (JohnWiley&Son, 2000).

[4] O. S. Lee, S.S. Choi and D.H. Kim: Solid State Phenomena, Vol. 110(2006), pp.221-230.

[5] J. Y. H. Chia, B. Copterell, T. C. Chai: Materials Science and Engineering , A Vol. 417(2006), pp.259-274.