Microstructure and Mechanical Properties of High Densification Mo/Cu Composites


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Microstructure and mechanical properties of the 55%, 60% and 67% Mo/Cu composites for electronic packaging application fabricated by a patent squeeze casting route have been investigated. The results show that Mo particles are homogeneously distributed in the matrix, and the Mo-Cu interfaces are clean, free from interfacial reaction products and amorphous layers. The densification of the Mo/Cu composites is higher than 99%. The as-received composites exhibit a Brinell hardness varying from HB178.1 to HB196.9 and an elastic modulus varying from 177GPa to 213 GPa. The tensile strength of the composites is higher than 480MPa. Moreover, the composites display favorable plasticity, while the elongation of the 55% Mo/Cu composite is as high as 5%. Obtaining high tensile strength and elongation in the composite is attributed to the high densification, as well as the clean and smooth Mo-Cu interfaces, both resulting from the cost-effective squeeze-casting technology.



Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie




G. Q. Chen et al., "Microstructure and Mechanical Properties of High Densification Mo/Cu Composites ", Key Engineering Materials, Vols. 353-358, pp. 2883-2886, 2007

Online since:

September 2007




[1] F. Erdogan: Composites Eng. Vol. 5 (1995), P. 753.

[2] N.Y.A. Shammas: Microelectron. Reliab. Vol. 43 (2003), p.519.

[3] A.J. Markworth, K.S. Ramesh and W.P. Parks: J. Mater. Sci. Vol. 30(1995), p.2183.

[4] A.B. Lostetter, F. Barlow and A. Elshabini: Microelectron. Reliab. Vol. 40 (2000), p.365.

[5] J.L. Johnson: Int. J. Powder Metall. Vol. 35(1999), p.39.

[6] N. Chawla and Y.L. Shen: Adv. Eng. Mater. Vol. 3 (2001), p.357.

[7] M. Robins: Electronic Packaging and Products. Vol. 10 (2000), p.50.

[8] R. Hocine and A. Boudghene: Microelectron. Eng. Vol. 65(2003), p.293.

[9] T. Arikawa and A. Ichida: J. Soc. Mater. Sci., Jpn. Vol. 48 (1999), p.295.

[10] M. Wenchuan and G. Jlalin: J. Mater. Sci. Lett. Vol. 16 (1997), p.1867.

[11] M.V. Gopalakrishnan and K. Metzgar: J. Mater. Process. Technol. Vol. 135 (2003), p.228.

[12] S.P. Ringer, T. Sakural and I.J. Polmear: Acta mater. Vol. 45(1997), p.3731.

[13] G.Q. Chen, G.H. Wu, and D.Z. Zhu. 2005 6th International conference on electronics packaging technology. Shenzhen, China. August, 2005: p.321~324.

[14] G.H. Wu. China Patent 200410028822. 7(2004).

[15] J. Matejicek and S. Sampath: Acta. Mater. Vol. 49 (2001), p. (1993).

[16] J. Llorca: Prog. Mater. Sci. Vol. 47 (2002) p.283.

[17] I.E. Anderson and J.C. Foley: Surf. Int. Anal. Vol. 31 (2001) p.599.

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