Thermal Stress Distribution in the Corner of IC Package Structure

Abstract:

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Passivation cracking is one of the main failures of Integrated circuits (ICs). A major cause for these failures is due to the mismatch of Coefficients of Thermal Expansion (CTE), Young’s modulus, Poisson’s ratios of package materials. In this paper, in order to analysis the stress distribution around the passivation layer corner, the finite element simulations and simplified analytical solutions are both applied. Then the comparison of stress values is made between the FEM result and simplified analytical solution, which shows that there is a good agreement. Based on these analyses, a conclusion can be drawn out that the simplified analytical model can be used to analyze the maximum stress around the passivation layer corner fast when design a chip preliminarily.

Info:

Periodical:

Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie

Pages:

2900-2903

DOI:

10.4028/www.scientific.net/KEM.353-358.2900

Citation:

H. P. Li et al., "Thermal Stress Distribution in the Corner of IC Package Structure", Key Engineering Materials, Vols. 353-358, pp. 2900-2903, 2007

Online since:

September 2007

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Price:

$35.00

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