Crack Propagation Behavior at Sn37Pb-Copper Interface in Low Cycle Fatigue

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This paper studies the crack propagation at Sn37Pb-copper interface in push-pull low cycle fatigue. Bonded specimens of Sn37Pb and copper having notch holes with different distances from the interface were fatigued at 313K and the crack propagation paths were observed. Cracks propagated at the interface when the notch hole was near the interface but propagated in the solder when the notch hole was away from the interface. The propagation rate of the interfacial crack was faster than that of non-interface crack. The crack path and crack propagation rate of the two types of cracks were discussed in relation to J integral range calculated by finite element method.

Info:

Periodical:

Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie

Pages:

2962-2965

Citation:

M. Sakane et al., "Crack Propagation Behavior at Sn37Pb-Copper Interface in Low Cycle Fatigue", Key Engineering Materials, Vols. 353-358, pp. 2962-2965, 2007

Online since:

September 2007

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$38.00

[1] M. Nozaki, M. Sakane, Y. Tsukada and H. Nishimura, Proceeding of the 41th Symposium on Strength of Materials at High Temperatures, JSMS (2003), p.37.

[2] H. Nose, M. Sakane, M. Yamashita and K. Shiokawa, Transactions of the Japan Society of Mechanical Engineers, Series A, Vol. 69-684 (2003), p.1222.

[3] JSMS Committee on High Temperature Strength of Materials : Factual Database on Creep and Creep-Fatigue Properties of Sn-37Pb and Sn-3. 5Ag Solders (Japan Society of Materials Science, 2004).

DOI: https://doi.org/10.1115/imece2005-80532