Strengthening of Cu-Ti2SnC Composites due to Microstructural Changes in the Material
Ti2SnC dispersion-strengthened (DS) copper matrix composites were prepared by hot-pressing method. The changes of mechanical properties of the composites as a function of microstructure were studied. The results demonstrated that the grain size of Cu decreased pronouncedly by incorporating of Ti2SnC, and the strengthening effect was significant. The addition of 5 vol.% Ti2SnC particles to Cu resulted in a near five-fold increase in the yield strength and the tensile strength also increased by 188 MPa. The magnitude of the increase was a function of the change of the microstructure.
Yu Zhou, Shan-Tung Tu and Xishan Xie
J. Y. Wu and K. Chai, "Strengthening of Cu-Ti2SnC Composites due to Microstructural Changes in the Material", Key Engineering Materials, Vols. 353-358, pp. 429-432, 2007