Strengthening of Cu-Ti2SnC Composites due to Microstructural Changes in the Material

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Ti2SnC dispersion-strengthened (DS) copper matrix composites were prepared by hot-pressing method. The changes of mechanical properties of the composites as a function of microstructure were studied. The results demonstrated that the grain size of Cu decreased pronouncedly by incorporating of Ti2SnC, and the strengthening effect was significant. The addition of 5 vol.% Ti2SnC particles to Cu resulted in a near five-fold increase in the yield strength and the tensile strength also increased by 188 MPa. The magnitude of the increase was a function of the change of the microstructure.

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Periodical:

Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie

Pages:

429-432

Citation:

J. Y. Wu and K. Chai, "Strengthening of Cu-Ti2SnC Composites due to Microstructural Changes in the Material", Key Engineering Materials, Vols. 353-358, pp. 429-432, 2007

Online since:

September 2007

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$38.00

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