Thermal-Hygro-Mechanical Design for CMOS Image Sensor
The characteristic of overall structure for CMOS image sensor has been studied in this research. A three-dimensional solid model of CMOS image sensor based on finite element ANSYS software is developed to predict the thermo-induced strain and the stress induced by moisture absorption. The predicted thermal-induced displacements were found to be very good agreement with the Moiré interferometer experimental in-plane deformation. The developed finite element 3D model, therefore, is applied to simulate the mechanism of thermal and hygroscopic stresses based on JEDEC pre-condition standard JESD22-A120. A series of comprehensive parametric studies were conducted in this research. The design rules for thermal optimization of CMOS image senor are summarized.
Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO
H. C. Hsu et al., "Thermal-Hygro-Mechanical Design for CMOS Image Sensor ", Key Engineering Materials, Vols. 364-366, pp. 1151-1156, 2008