The Influence of Surfactant CTAB on the Microstructure and Material Properties of Nickel Microelectroforming


Article Preview

The influence of surfactant CTAB (cetyl trimethyl ammonium bromide) on electrodeposited nickel layer has been investigated in this research. Our result shows that CTAB added in the electrolysis bath can effectively remove the hydrogen to obtain a smoother nickel layer. The effect of CTAB on the surface roughness is also significant. It may be ascribed to the adsorption of CTAB on the electrode surface which results in a hindering effect in the electrodeposition process. Increasing the concentration of CTAB, the grain size of nickel deposit was reduced and the microhardness of the nickel deposit was therefore improved. The hardness of the metal layer can be promoted to 450 Hv when 300 ppm CTAB is added.



Key Engineering Materials (Volumes 364-366)

Edited by:

Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO




Y. C. Chen et al., "The Influence of Surfactant CTAB on the Microstructure and Material Properties of Nickel Microelectroforming", Key Engineering Materials, Vols. 364-366, pp. 346-350, 2008

Online since:

December 2007




[1] R. Weil and W.N. Jacobus Jr: Plating Vol. 53 (1966), p.102.

[2] T.A. Costavaras, M. Froment, A.H. -Le Goff and C. Georgoulis: J. Electrochem. Soc. Vol. 120 No. 7 (1973), p.867.


[3] St. Rashkov and N. Atanasov: Electrodeposition Surf. Treat. Vol. 3 No. 2 (1975), p.105.

[4] J. Amblard, I. Epelboin, M. Froment and G. Maurin: J. Appl. Electrochem. Vol. 9 No. 2 (1979), p.233.

[5] Y. Nakamura, N. Kaneko, M. Watanabe and H. Nezu: J. Appl. Electrochem. Vol. 24 No. 3 (1994), p.227.

[6] S.H. Wu and D.H. Chen: J. Colloid and Interface Sci. Vol. 273 No. 1 (2004), p.165.

[7] F. Li, C. Vipulanandan and K.K. Mohanty: Colloids and Surfaces A, Physicochemical and Engineering Aspects Vol. 223 No. 1-3 (2003), p.103.

[8] Y. Jia, T. Wiliana; K. Chen, Z. Yun, Tam, C. Kam, J. Ma and S. Bernard: J. Materials Chemistry, Vol. 13 No. 12 (2003), p.3053.


[9] Y.Y. Lim and K.H. Lim: J. Colloid and Interface Sci. Vol. 196, No. 1 (1997), p.116.

[10] R. Vittal, H. Gomathi and G.P. Rao: Electrochimica Acta Vol. 45, No. 13 (2000), p. (2083).

[11] T.Y. Soror and M.A. El-Ziady: Mater. Chem. Phys. Vol. 77, No. 12, (2003), p.697.