Method of Examining Surface Cracks on Monocrystalline Silicon


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A new method on examining the micro cracks of monocrystalline silicon during nano indentation is proposed. It is established based on a study of the increasing rate of absorbed energy in nano indentation. This method provides a simple approach in understanding whether cracks on the silicon surfaces occur, while it is tedious in conventional method.



Key Engineering Materials (Volumes 364-366)

Edited by:

Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO




F. Z. Fang et al., "Method of Examining Surface Cracks on Monocrystalline Silicon", Key Engineering Materials, Vols. 364-366, pp. 920-924, 2008

Online since:

December 2007




[1] W. S. Blackley, R. O. Scattergood: Precision Engineering Vol. 13 (1991), p.95.

[2] F. Z. Fang, G. X. Zhang: International Journal of Advance Manufacturing Technology Vol. 22 (2003), p.703.

[3] F. Z. Fang, Y. C. Liu: Journal of Micromechanics and Microengineering Vol. 14 (2004), p.984.

[4] T. Shibata, S. Fujii, E. Makino, M. Ikeda: Precision Engineering Vol. 18 (1996), p.129.

[5] F. Z. Fang, V. C. Venkatesh: Annals of the CIRP Vol. 47 (1998), p.45.

[6] T. Inamura, N. Takezawa, Y. Kumaki, T. Sata: Annals of the CIRP Vol. 43 (1994), p.47.

[7] P. S. Pizani, R. Jasinevicius, J. G. Duduch, A. J. V. Porto: Journal of Materials Science Letters Vol. 18 (1999), p.1185.


[8] B. Lawn: Fracture of Brittle Solids (Cambridge University Press, UK. 1993).

[9] F. Z. Fang, H. Wu, Y. C. Liu: International Journal of Machine Tools and Manufacture Vol. 45 (2005), p.1681.