Method of Examining Surface Cracks on Monocrystalline Silicon

Abstract:

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A new method on examining the micro cracks of monocrystalline silicon during nano indentation is proposed. It is established based on a study of the increasing rate of absorbed energy in nano indentation. This method provides a simple approach in understanding whether cracks on the silicon surfaces occur, while it is tedious in conventional method.

Info:

Periodical:

Key Engineering Materials (Volumes 364-366)

Edited by:

Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO

Pages:

920-924

DOI:

10.4028/www.scientific.net/KEM.364-366.920

Citation:

F. Z. Fang et al., "Method of Examining Surface Cracks on Monocrystalline Silicon", Key Engineering Materials, Vols. 364-366, pp. 920-924, 2008

Online since:

December 2007

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Price:

$35.00

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