Method of Examining Surface Cracks on Monocrystalline Silicon


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A new method on examining the micro cracks of monocrystalline silicon during nano indentation is proposed. It is established based on a study of the increasing rate of absorbed energy in nano indentation. This method provides a simple approach in understanding whether cracks on the silicon surfaces occur, while it is tedious in conventional method.



Key Engineering Materials (Volumes 364-366)

Edited by:

Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO




F. Z. Fang et al., "Method of Examining Surface Cracks on Monocrystalline Silicon", Key Engineering Materials, Vols. 364-366, pp. 920-924, 2008

Online since:

December 2007




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DOI: 10.1023/a:1006694310171

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