Nano Molding Technology for Optical Storage Media with Large-Area Nano-Pattern


Article Preview

Nano hot or thermal embossing has many advantages of comparatively few process steps, simple operation, relatively low tooling cost and high replication accuracy for small features. However, because of its long processing time, it has been known as being less competitive than nano injection molding. In order to overcome the weakness of long processing time, the high speed nano hot embossing system has been developed and its characteristics were investigated. Nanopatterned stampers made of Ni and Si were fabricated by the laser mastering and electroforming process and the DRIE and LPCVD or thermal oxidation process respectively. In order to make the processing time shorter and get relatively higher aspect ratio nano/micro features, especially, the temperatures of the molds were controlled actively and precisely during the embossing process. Through various experiments, nano embossing parameters, such as temperature, pressure and processing time, are optimized and the high aspect ratio nano features could be obtained.



Key Engineering Materials (Volumes 364-366)

Edited by:

Guo Fan JIN, Wing Bun LEE, Chi Fai CHEUNG and Suet TO




H. G. Shin et al., "Nano Molding Technology for Optical Storage Media with Large-Area Nano-Pattern", Key Engineering Materials, Vols. 364-366, pp. 925-930, 2008

Online since:

December 2007




[1] M. Heckele and W. K. Schomburg, Review on micro molding of thermoplastic polymers, J. Micromech. Microeng., Vol. 14, R1-R14, (2004).


[2] M. Heckele, W. Bacher, and K. D. Műller, Hot embossing - The molding technique for plastic microstructures, Microsystem Technologies, Vol. 4 (1998), p.122.


[3] H. Becker and U. Heim, Thomas, Hot embossing as a method for the fabrication of polymer high aspect ratio structures, Sensors and Actuators, Vol. 83 (2000), p.130.


[4] Chou, S. Y., Krauss, P. R., Renstrom, Nanoimprint lithography, J. Vacuum Science and Technology B, Vol. 14, Issue 6 (1996), p.4129.

[5] Yoshihiko, H., Masaki, F., Takahiro, O., Yoshio, T., Study of the resist deformation in nanoimprint lithography, Journal of Vacuum Science and Technology B, Vol. 19, No. 6 (2001), p.2811.

[6] Stephen, Y., Peter, R., Preston, J., Imprint of sub-25nm vias and trenches in polymers, Applied Physics Letters, No. 67 (1995), p.3114.


[7] Aristone, F., et al., Molded multilevel modular micro-fludic devices, Proceedings of SPIE, No. 4982 (2003), p.65.