Thermal Conductivities of β-Si3N4 and BN-Filled Epoxy Molding Compounds (EMC)


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New electric molding composites were fabricated with hybridizing epoxy and several fillers. The examined fillers were β-Si3N4, BN and fused silica or their combinations. The thermal conductivity of β-Si3N4 filler was compared with BN as filler for advanced epoxy molding compounds. The influence of pure resin matrix and mixture matrix on the thermal conductivity of EMC was discussed. The results were explained with Maxwell equation.



Key Engineering Materials (Volumes 368-372)

Edited by:

Wei Pan and Jianghong Gong




Z. Yuan and K. X. Chen, "Thermal Conductivities of β-Si3N4 and BN-Filled Epoxy Molding Compounds (EMC)", Key Engineering Materials, Vols. 368-372, pp. 1071-1073, 2008

Online since:

February 2008





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