A Piezoelectric Micropump Based on MEMS Fabrication

Abstract:

Article Preview

This paper presents a valve-less micropump which is actuated by a piezoelectric ceramic chip. We employ a microelectromechanical system process for the silicon substrate and anodic bonding for assembly of the Pyrex glass and silicon wafer. The reciprocating type micropump contains two nozzle/diffuser elements and a silicon membrane with an embedded piezoelectric ceramic actuator.

Info:

Periodical:

Key Engineering Materials (Volumes 368-372)

Edited by:

Wei Pan and Jianghong Gong

Pages:

215-217

Citation:

B. W. Wang et al., "A Piezoelectric Micropump Based on MEMS Fabrication", Key Engineering Materials, Vols. 368-372, pp. 215-217, 2008

Online since:

February 2008

Export:

Price:

$38.00

[1] T. Xua, S. Ji: Sensors and Actuators A Vol. 121 (2005), pp.267-274.

[2] P. Woias: Sensors and Actuators B Vol. 105 (2005), pp.28-38.

[3] C. Yamahata, F. Lacarme, et al.: Microelectronic Engineering. Vol. 78-79 (2005), pp.132-137.

[4] M. GadelHak: The MEMS Handbook (CRC PRESS, New York, USA, 2002). Fig. 6 Photograph of silicon wafer after the first etching process Fig. 7 Photograph of silicon wafer after the second etching process Fig. 8 Photograph of diffusers of inlet and outlet.

Fetching data from Crossref.
This may take some time to load.