Influence of the Plating Conditions on the Structure and Corrosion Resistance of the Ni-Mn Alloy

Abstract:

Article Preview

This paper reported the electrodeposition of the nickel manganese alloy coatings from a sulphate bath using sodium citrate as complexing agent. The cyclic voltammetric experiments showed that the alloy initiative codeposition potential was about –0.457 V (vs.SCE). The effect of the plating conditions on the composition and the structure of the Ni-Mn were studied by energy dispersive X-ray spectrum and X-ray diffractometer, respectively. As a result, with the increase of the cathodic current density from 10 to 40 mA·cm-2, the manganese content of the deposit increased from 4.4 at% to 10.3 at%, and then it slightly decreased. The phase structure of the coating was face centered lattice (Fm3m) Ni-Mn solid solution. The corrosive polarization experiments indicated that the deposit could work as sacrificial coating for carbon steel in 3.5 wt% sodium chloride solution.

Info:

Periodical:

Key Engineering Materials (Volumes 373-374)

Main Theme:

Edited by:

M.K. Lei, X.P. Zhu, K.W. Xu and B.S. Xu

Pages:

442-445

DOI:

10.4028/www.scientific.net/KEM.373-374.442

Citation:

S. L. Wang and W. W. Yu, "Influence of the Plating Conditions on the Structure and Corrosion Resistance of the Ni-Mn Alloy", Key Engineering Materials, Vols. 373-374, pp. 442-445, 2008

Online since:

March 2008

Export:

Price:

$35.00

[1] N.Y.C. Yang, T.J. Headley, J.J. Kelly, J.M. Hruby, Scripta Mat., 51 (2004) 761-766.

[2] N. Atanassov, V. Mitreva, Surf. & Coatings Tech., 78 (1996) 144-149.

[3] A. Stephen a, T. Nagarajan a, M.V. Ananth, Mat. Sci. and Eng., B55 (1998) 184-186.

[4] M.V. Ananth, Trans. IMF, 75 (6) (1997) 224-229.

[5] W.R. Wearrnouth and K.C. Belt, Plating & Surf. Fin., Oct. (1979) 53-56.

[6] W.R. Wearmouth, Trans. Inst. Met. Fin., 60 (1982) 68-72.

[7] J.W. Dini, H.R. Johnson and L.A. West, Plating & Surf. Fin., Feb. (1978) 36-39.

[8] H.R. Johnson, J.W. Dini and R.E. Stoltz, Plating & Surf. Fin., Feb. (1979) 57-41.

[9] J.J. Kelly, S.H. Goods, N.Y.C. Yang, Electrochem. & Solid State Letters, 6 (2003) C88-C91.

[10] S.H. Goods, J.J. Kelly, N.Y.C. Yang, Microsystem Tech., 10 (6-7) (2004)498-505.

[11] E.A. Marquis, A.A. Talin, J.J. Kelly, S.H. Goods, J.R. Michael, J. Applied Electrochem., 36(2006)669-676.

In order to see related information, you need to Login.