Mathematical Model of the Part Surface Temperature Field


Article Preview

Research on the simulation and calculation of the temperature field of friction plate in brake is one of the main references for constructing a frictional material couple. The friction heat generates on the real contact area, so the distribution of the friction heat is asymmetry and localized. In this study, the effects of real contact area on the surface temperature were investigated. Then the mathematical model of the two-dimensional unsteady temperature field of local contact area is presented. The simulation of the model for Cu-based wet friction plate indicates that the local contact has an essential influence on the surface temperature and the maximal contact temperature; the mathematic model of local contact temperature field can be used to predict the critical sliding velocity and allowable rate of energy absorbed.



Key Engineering Materials (Volumes 373-374)

Main Theme:

Edited by:

M.K. Lei, X.P. Zhu, K.W. Xu and B.S. Xu




J. H. Du et al., "Mathematical Model of the Part Surface Temperature Field", Key Engineering Materials, Vols. 373-374, pp. 539-542, 2008

Online since:

March 2008




[1] C.H. Gao, X.Z. Lin. Journal of Materials Processing Technology, Vol. 129 (2002), p.513.

[2] Z. Przemyslaw, A. T. Wear, Vol. 253 (2003), p.474.

[3] H. Q. Sun, J. F. Dong. Engineering Machinery, Vol. 10 (1992), p.18.

[4] Z. Olesiak, Yu. Pyryev, and A. Yevtrshenko. Wear, Vol. 210 (1997), p.120.

[5] B.S. Xu, S.H. Zhu. Theories and Technologies on Surface Engineering. (National Defence Publications, China 2001).

[6] J.H. Du, W.Z. Han, and S.L. Fu. Armored Force Engineering Institute, Vol. 16 (2002), p.57.

[7] J.H. Du, H.D. Ding, and S.L. Fu. Power Metallurgy Technology, Vol. 21 (2003), p.19.

[8] S.Z. Wen. Principle of Tribology. (Publishing House of Tsinghua University, China 1990).

[9] G.S. Dai. Heat Transfer. (Publishing House of Higher Education, China 2002).

[10] T.L. Lin, R.F. Li, and C.Y. Yang. Mechanical Science and Technology, Vol. 22 (2003), p.39 t/s T/℃ T/℃.