Interfacial Reactions in Sn-xZn-Cu/Cu Couples during Soldering

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The microstructure evolution and the growth behavior of intermetallic compounds (IMCs) at Sn-xZn-2Cu/Cu (x=6.5, 8.8, 10 and 12, wt%) interfaces during soldering were investigated. The results indicate that planar Cu5Zn8 layer is formed at each interface of Sn-8.8Zn-2Cu/Cu, Sn-10Zn- 2Cu/Cu and Sn-12Zn-2Cu/Cu couples for all soldering time. However, for Sn-6.5Zn-2Cu/Cu couple, it is Cu5Zn8 phase that formed at the interface within shorter soldering time (1 h and 4 h), but the interfacial reaction products become a double layer structure of Cu6Sn5 phase (near Cu substrate) and CuZn phase (near solder) for longer soldering time (25 h and 49 h). The thickness of IMC layers in all couples increases exponentially with the soldering time. It is also found that for the same soldering time, the thickness of IMC layers increases with increasing Zn content in the solder.

Info:

Periodical:

Key Engineering Materials (Volumes 373-374)

Main Theme:

Edited by:

M.K. Lei, X.P. Zhu, K.W. Xu and B.S. Xu

Pages:

543-546

DOI:

10.4028/www.scientific.net/KEM.373-374.543

Citation:

N. Zhao et al., "Interfacial Reactions in Sn-xZn-Cu/Cu Couples during Soldering", Key Engineering Materials, Vols. 373-374, pp. 543-546, 2008

Online since:

March 2008

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$38.00

[1] M. Abtew and G Selvaduray: Mater Sci Eng R., 27(2000), p.95.

[2] N.C. Lee: Soldering & Surf Mount Technol., Vol. 26(1997), p.65.

[3] I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra and O. Unal: J Electon Mater., Vol. 30(2001), p.1050.

[4] J.H. Vincent and G. Humpston: GEC J Res., Vol. 11(1994), p.76.

[5] Y.S. Kim, K.S. Kim, C.W. Hwang and K. Suganuma: J Alloys Comp., Vol. 352(2003), p.237.

[6] K.L. Lin and C.L. Shih: J Electron Mater., Vol. 32(2003), p.95.

[7] M. McCormack and S. Jin: J Electron Mater., Vol. 23(1994), p.715.

[8] H.P. Xie, D.Q. Yu, H.T. Ma and L. Wang: Chin J Nonferrous Met., Vol. 14(2004), p.1694.

[9] D.Q. Yu, H.P. Xie and L. Wang: J Alloys Comp., Vol. 385(2004), p.119.

[10] C.Y. Chou, S.W. Chen and Y.S. Chang: J Mater Res., Vol. 21(2006), p.1849.

[11] D.Q. Yu, C.M.L. Wu, C.M.T. Law, L. Wang and J.K.L. Lai: J Alloys Comp., Vol. 392(2005), p.192.

[12] L.H. Su, Y.W. Yen, C.C. Lin and S.W. Chen: Metall Mater Trans B, Vol. 28(1997), p.927.

[13] R.A. Gagliano and M.E. Fine: J Electron Mater., Vol. 32(2003), p.1441.

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