Study on Preparation and Properties of a Room Temperature Fast Curing Epoxy Resin Nano-Adhesive
A room temperature fast curing epoxy resin nano-adhesive was prepared and modified by nano-SiO2 and liquid rubber CTBN. It shows good shear strength value and heat-durability and also meets the conditions of room temperature and short solidified time. Compared with conventional resin mixing method, adhesive modified by nanomaterial can achieve better heat-durability. Compound cation/nonionic surfactants were used for modifying nano-SiO2 and solution mix method was used for preparation of nano-SiO2 epoxy resin adhesive. The effects of nano-SiO2 to adhesive’s mechanical property and heat-durability were investigated. Adhesive with 2wt% nano-SiO2 shows improved properties which shear strength value is 17.9 MPa and vitrification point is 216.5°C. Micropores and grains of nano-SiO2/liquid rubber CTBN modifying system were observed using scanning electron microscope. Adhesives were investigated using infrared spectroscopy analysis. Nano-SiO2 modified using compound surfactant has higher reacting activity and accelerates the reaction of adhesive. It can be used as catalyst.
M.K. Lei, X.P. Zhu, K.W. Xu and B.S. Xu
S. N. Ma et al., "Study on Preparation and Properties of a Room Temperature Fast Curing Epoxy Resin Nano-Adhesive ", Key Engineering Materials, Vols. 373-374, pp. 662-665, 2008